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Wafer dicing machine
Introduction

project

parameter

workpiece size

12" round, IT" square

Spindle power

2.4KW, 0.34Nm

features

Smart GUI, easy to operate double-sided spindle

 

Double Sided Spindle, w/ LD/UL & Spin Cleaner

 

High cutting efficiency

HOTLINE:400-600-8500

If there is any need for our service, please contact us, we will have someone to contact you, thank you!CONTACT

In order to pursue the excellent quality of our products, we continually develop manufacturing technology. A superior testing environment was created to guarantee high accuracy and quality of each our provided equipment. Besides, we constantly focus on improving the manufacturing process to increase efficiency and productivity, and to reduce production cost. We, therefore, are able to immeditately respond to customers’ needs with highly competitive products.

CONTACT

M&R Nano Technology Co., LTD. : No. 10, Lane 863, Gaoshi Road, Yangmei District, Taoyuan City
M&R Nano Technology (Dongguan) Co., LTD. : No. 239-7, Middle Dezheng Road, Xianxi Community, Chang 'an Town, Dongguan City

400-699-2885

sam@mrnanotec.com

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