Fully automatic blending/developing equipment
Introduction
project
|
parameter
|
type
|
Automatic loading /unloading
|
Rotating speed
|
10-6000rpm
|
Wafer size
|
2-12 inches
|
hot plate temperature
|
Maximum 150°C
|
Control System
|
PLC,PC
|
Uniformity
|
≥3% and ≤5%
|
HOTLINE:400-600-8500