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Mini LED
Introduction
Mini LED
01 Basic Concepts
Mini LED refers to LED chips with a size on the order of 100 μm, which is between small-pitch LEDs and Micro LEDs, and is the result of further refinement of small-pitch LEDs. Among them, small-pitch LED refers to LED backlight or display products with the pitch of adjacent lamp beads below 2.5 mm.
Compared with the current mainstream display technology LCD. The mini LED has a better display effect, the response speed has been improved by an order of magnitude, the screen can be thinner, and the power consumption is greatly reduced.
Can extend battery life. Compared with OLED display, mini LED has faster response speed and higher high temperature reliability while maintaining excellent display effect and flexibility.

02 Mini LED application introduction
1. Backlight Mini LED products




2. Direct display Mini LED products


3. Plant lighting Mini LED products


03 Process comparison
1. Technical comparison


2. Equipment Capability - Product Compatibility


3. Mini LED welding effect


4. Equipment capacity - welding capacity


5. Device lighting effect

The traditional process cannot guarantee the consistency and flatness of the chip surface, resulting in the phenomenon of mura and edge measurement


The mass transfer technology of Keyi Technology adopts the press-fit single-point welding process to effectively ensure the consistency and flatness of the product

surface
. material


Pasting and tearing film process:


05 Slit type spraying device
Main actions: feeding → flux spraying → discharging


06 Chip arrangement and transfer device
Main actions: feeding→CCD identification→chip arrangement→discharging


Chip Transfer Calibration Process

Schematic Diagram of Transfer Arrangement


07 Chip laser batch welding device
Main actions:
feeding → CCD alignment → pressing → laser welding → discharging


Chip laser batch welding process


08 Test the AOI device.
Main actions: feeding → CCD alignment → optical detection


Electrical testing AOI inspection process:


09 Chip removal device
Main actions: feeding → CCD alignment → laser decrystallization → discharging


Chip Removal Process


10 Crystal Replenishment Rework Device
Main Actions:
Material Feeding → CCD Alignment → Dispensing and Tin Replenishment → Swing Arm Crystal Replenishment → Laser Welding → Discharging


Crystal rework process:



11 Automatic transmission device for the whole line


12 Solution overview
1. Mini LED mass transfer whole line solution


2. Advantages of line layout
Keyi Technology MiniLED mass transfer line
UPH 720K
covers an area of 65㎡
and total energy consumption is 100KWH


13 Main parameters


HOTLINE:400-600-8500

If there is any need for our service, please contact us, we will have someone to contact you, thank you!CONTACT

In order to pursue the excellent quality of our products, we continually develop manufacturing technology. A superior testing environment was created to guarantee high accuracy and quality of each our provided equipment. Besides, we constantly focus on improving the manufacturing process to increase efficiency and productivity, and to reduce production cost. We, therefore, are able to immeditately respond to customers’ needs with highly competitive products.

CONTACT

M&R Nano Technology Co., LTD. : No. 10, Lane 863, Gaoshi Road, Yangmei District, Taoyuan City
M&R Nano Technology (Dongguan) Co., LTD. : No. 239-7, Middle Dezheng Road, Xianxi Community, Chang 'an Town, Dongguan City

400-699-2885

sam@mrnanotec.com

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